# US 2010/0163299 A1 · Electronic device and high frequency circuit board thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2010/0163299 A1 - Document ID: US20100163299A1 - Status: Published application - Kind: A1 - Application number: 12/639,150 - Filed: 2009-12-16 - Published: 2010-07-01 - Earliest claimed: 2008-12-31 - Inventors: Hsu-Kuan Hsu; Ching-Jung Tsai; Shih-Nien Huang; Wei-Chih Chang - Web page: https://patentgrep.com/patent/US20100163299A1 ## CPC - H05K 1/0253: {Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings (H05K1/0251 takes precedence)} - H05K 1/0298: {Multilayer circuits} - H05K 2201/0715: provided by an outer layer of PCB - H05K 2201/0969: Apertured conductors - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic device and a high frequency circuit board thereof are disclosed. The high frequency circuit board includes a first dielectric layer, a first signal line formed on the first dielectric layer, a second dielectric layer overlaying the first dielectric layer and covering the first signal line, and a first EMI shielding layer overlaying the second dielectric layer. The first EMI shielding layer has a gap formed thereon. The gap is formed at a position corresponding to the position of the first signal line. ## Claims ### Claim 1 A high frequency circuit board, comprising: a first dielectric layer; a first signal line formed on an upper surface of the first dielectric layer; a second dielectric layer overlaying the upper surface of the first dielectric layer and covering the first signal line; and a first electromagnetic interference (EMI) shielding layer overlaying the second dielectric layer and having a gap formed thereon, wherein the gap is formed at a position corresponding to the position of the first signal line. ### Claim 2 (depends on 1) The high frequency circuit board as claimed in claim 1, wherein the second dielectric layer defines a first projection area on which the first signal line is vertically projected, and the first projection area is positioned within the gap. ### Claim 3 (depends on 2) The high frequency circuit board as claimed in claim 2, wherein the first EMI shielding layer has a first side and a second side defining the gap therebetween, the first projection area is positioned between the first side and the second side, and an interval between the first projection area and the first side is 0.5 to 3 times the width of the first signal line. ### Claim 4 (depends on 2) The high frequency circuit board as claimed in claim 2, wherein the first projection area is positioned at the center of the gap. ### Claim 5 (depends on 1) The high frequency circuit board as claimed in claim 1, wherein the high frequency circuit board is configured to transmit a high frequency signal having a frequency higher than 100 MHz. ### Claim 6 (depends on 1) The high frequency circuit board as claimed in claim 1, wherein the high frequency circuit board is a hard circuit board or a flexible circuit board. ### Claim 7 (depends on 3) The high frequency circuit board as claimed in claim 3, further comprising: a second signal line formed on the first dielectric layer, wherein the second dielectric layer defines a second projection area on which the second signal line is vertically projected, and the second projection area is positioned between the first side and the second side within the gap. ### Claim 8 (depends on 7) The high frequency circuit board as claimed in claim 7, wherein an interval between the second projection area and the second side is 0.5 to 3 times the width of the second signal line. ### Claim 9 (depends on 1) The high frequency circuit board as claimed in claim 1, further comprising a second EMI shielding layer covering a lower surface of the first dielectric layer. ### Claim 10 (depends on 9) The high frequency circuit board as claimed in claim 9, wherein the first EMI shielding layer and the second EMI shielding layer are made of metal material. ### Claim 11 An electronic device, comprising: a high frequency circuit board, comprising: a first dielectric layer; a first signal line formed on an upper surface of the first dielectric layer; a second dielectric layer overlaying the upper surface of the first dielectric layer and covering the first signal line; and a first electromagnetic interference (EMI) shielding layer overlaying the second dielectric layer and having a gap formed thereon, wherein the gap is formed at a position corresponding to the position of the first signal line. ### Claim 12 (depends on 11) The electronic device as claimed in claim 11, wherein the second dielectric layer defines a first projection area on which the first signal line is vertically projected, and the first projection area is positioned within the gap. ### Claim 13 (depends on 12) The electronic device as claimed in claim 12, wherein the first EMI shielding layer has a first side and a second side defining the gap therebetween, the first projection area is positioned between the first side and the second side, and an interval between the first projection area and the first side is 0.5 to 3 times the width of the first signal line. ### Claim 14 (depends on 12) The electronic device as claimed in claim 12, wherein the first projection area is positioned at the center of the gap. ### Claim 15 (depends on 11) The electronic device as claimed in claim 11, wherein the high frequency circuit board is configured to transmit a high frequency signal having a frequency higher than 100 MHz. ### Claim 16 (depends on 11) The electronic device as claimed in claim 11, wherein the high frequency circuit board is a hard circuit board or a flexible circuit board. ### Claim 17 (depends on 13) The electronic device as claimed in claim 13, wherein the high frequency circuit board further comprises a second signal line formed on the first dielectric layer, the second dielectric layer defines a second projection area on which the second signal line is vertically projected, and the second projection area is positioned between the first side and the second side within the gap. ### Claim 18 (depends on 17) The electronic device as claimed in claim 17, wherein an interval between the second projection area and the second side is 0.5 to 3 times the width of the second signal line. ### Claim 19 (depends on 11) The electronic device as claimed in claim 11, wherein the high frequency circuit board further comprises a second EMI shielding layer covering a lower surface of the first dielectric layer. ### Claim 20 (depends on 19) The electronic device as claimed in claim 19, wherein the first EMI shielding layer and the second EMI shielding layer are made of metal material.