# US 2010/0163296 A1 · Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2010/0163296 A1 - Document ID: US20100163296A1 - Status: Published application - Kind: A1 - Application number: 12/468,058 - Filed: 2009-05-19 - Published: 2010-07-01 - Earliest claimed: 2008-12-31 - Assignees: Industrial Technology Research Institute - Inventors: Cheng-Ta Ko; Min-Lin Lee; Wei-Chung Lo; Shur-Fen Liu; Jinn-Shing King; Shinn-Juh Lai; Yu-Hua Chen - Web page: https://patentgrep.com/patent/US20100163296A1 ## CPC - H05K 1/0222: {for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence} - H05K 3/429: {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers} - H05K 2201/09636: Details of adjacent, not connected vias - H05K 2201/09645: Patterning on via walls; Plural lands around one hole - H05K 2201/09809: Coaxial layout - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via. ## Claims ### Claim 1 A method for manufacturing multi-coaxial leads within a single via in a circuit substrate comprising: preparing a first substrate, having a first ground metal on top and a first through hole; preparing a second substrate, having a base metal layer on top; stacking said first substrate on said base metal layer of said second substrate; forming a vertical metal in said first through hole; etching said vertical metal to form at least a first annular space encircling a first central lead and a second annular space encircling a second central lead; and forming vertical insulators in said first and second annular spaces to form a plurality of first coaxial leads and a second coaxial leads. ### Claim 2 (depends on 1) A method for manufacturing multi-coaxial leads within a single via in a circuit substrate as claimed in claim 1, further comprising: depositing a first insulation layer on top and etching said first insulation layer patternly to expose a first top end of said first central lead, to expose a second top end of said second central lead; and depositing a second metal layer on top and etching said second metal layer patternly to form a first circuit layer and electrically couple to said first top end of said first central lead, and to extend said second top end of said second central lead upward. ### Claim 3 (depends on 2) A method for manufacturing multi-coaxial leads within a single via in a circuit substrate as claimed in claim 2, further comprising: depositing a second insulation layer on top and etching said second insulation layer patternly to expose said second top end of said second central lead; and depositing a third metal layer on top and etching said third metal layer patternly to form a second circuit layer and electrically couple to said second top end of said second central lead. ### Claim 4 (depends on 3) A method for manufacturing multi-coaxial leads within a single via in a circuit substrate as claimed in claim 3, further comprising: removing said second substrate to expose a first bottom end of said first central lead and to expose a second bottom end of said second central lead; depositing a first bottom insulation layer and etching said first bottom insulation layer patternly to expose said first bottom end of said first central lead, expose said second bottom end of said second central lead; and depositing a second bottom metal layer on bottom and etching said second bottom metal layer patternly to form a first bottom circuit layer and to electrically couple to said first bottom end of said first central lead, and to extend said second bottom end of said second central lead downward. ### Claim 5 (depends on 4) A method for manufacturing multi-coaxial leads within a single via in a circuit substrate as claimed in claim 4, further comprising: depositing a second bottom insulation layer and etching said second bottom insulation layer patternly to expose said second bottom end of said second central lead; and depositing a third bottom metal layer on bottom and etching said third bottom metal layer patternly to form a second bottom circuit layer and to electrically couple to said second bottom end of said second central lead. ### Claim 6 Multi-coaxial leads within a single via in a circuit substrate, comprising: a substrate comprising at least a through hole; and a plurality of coaxial leads, comprising a plurality of first coaxial leads and a plurality of second coaxial leads, wherein said plurality of said first coaxial leads formed in said hole, wherein each of said first coaxial leads having a first outer lead and a first central lead; and said plurality of said second coaxial leads formed in said hole, wherein each of said second coaxial leads having a second outer lead and a second central lead. ### Claim 7 (depends on 6) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 6, wherein said first and second outer leads is a common outer lead. ### Claim 8 (depends on 6) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 6, further comprising: a first plurality of said coaxial leads, each of said first plurality of said coaxial leads having a first outer lead and a first central lead, configured in an outmost annular arrangement as a first annular arrangement within said hole, said first plurality of said coaxial leads having their first central leads as a first common top. ### Claim 9 (depends on 8) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 8, further comprising: a second plurality of said coaxial leads, each of said second plurality of said coaxial leads having a second outer lead and a second central lead, configured in a second annular arrangement next to said first annular arrangement within said hole, said second plurality of said coaxial leads having their second central leads as a second common top, said second common top configured higher than said first common top. ### Claim 10 (depends on 9) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 9, further comprising: a third plurality of said coaxial leads, each of said third plurality of said coaxial leads having a third outer lead and a third central lead, configured in a third annular arrangement next to said second annular arrangement within said hole, said third plurality of said coaxial leads having their third central leads as a third common top, said third common top configured higher than said second common top. ### Claim 11 (depends on 6) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 6, wherein said outer lead electrically are coupling to power or ground. ### Claim 12 (depends on 6) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 6, wherein said central leads are electrically coupling to a signal. ### Claim 13 (depends on 6) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 6, wherein said first central lead and said second central lead are electrically coupling to a same circuit layer. ### Claim 14 (depends on 6) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 6, wherein said first central lead and said second central lead are electrically coupling to different circuit layers. ### Claim 15 (depends on 6) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 6, wherein said first central lead and said second central lead are electrically coupling to a same bottom circuit layer. ### Claim 16 (depends on 6) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 6, wherein said first central lead and said second central lead are electrically coupling to different bottom circuit layers. ### Claim 17 (depends on 6) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 6, wherein said outer lead having a vertical length equivalent to that of said hole. ### Claim 18 (depends on 6) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 6, wherein said outer lead having a vertical length longer than that of said hole. ### Claim 19 (depends on 6) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 6, wherein said central lead has a top end and a bottom end coplanar with that of said outer lead. ### Claim 20 (depends on 6) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 6, wherein said central lead has a top end and a bottom end extruded out of that of said outer lead. ### Claim 21 (depends on 14) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 14, further comprising a second ground metal in between neighboring circuit layers. ### Claim 22 (depends on 8) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 8, wherein said first outer lead is electrically coupling to a first ground metal. ### Claim 23 (depends on 9) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 9, wherein said second outer lead is electrically coupling to a second ground metal in between said first circuit layer and said second circuit layer. ### Claim 24 (depends on 10) Multi-coaxial leads within a single via in a circuit substrate as claimed in claim 10, wherein said third outer lead is electrically coupling to a third ground metal in between said second circuit layer and said third-second circuit layer.