# US 2010/0163291 A1 · Substrate embedded with passive device

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- Number: US 2010/0163291 A1
- Document ID: US20100163291A1
- Status: Published application
- Kind: A1
- Application number: 12/722,212
- Filed: 2010-03-11
- Published: 2010-07-01
- Earliest claimed: 2005-10-17
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Seung-Hyun CHO; Il-Soung YOON; Won-Cheol BAE; Se-Jong OH
- Web page: https://patentgrep.com/patent/US20100163291A1

## CPC

- H05K 1/188: {manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component}
- H10W 44/601: {Capacitive arrangements (H10W44/20 takes precedence)}
- H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads}
- H05K 2201/0347: Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
- H05K 2201/0355: Metal foils
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 72/90: Bond pads, in general
- H10W 72/9415: {relative to the surface, e.g. recessed, protruding}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A substrate embedded with a passive device, including a substrate, on which a cavity is formed; a passive device in the cavity, the passive being pre-molded; and a conductive material for adhering the passive device to the cavity, the conductive material being laminated on the cavity.

## Claims

### Claim 1

A substrate embedded with a passive device, comprising:
a substrate, on which a cavity is formed;
a passive device in the cavity, the passive being pre-molded; and
a conductive material for adhering the passive device to the cavity, the conductive material being laminated on the cavity.

### Claim 2 (depends on 1)

The substrate of claim 1, wherein the passive device is selected from the group consisting of a resistance, an inductor and a condenser.

### Claim 3 (depends on 1)

The substrate of claim 1, wherein the condenser is a multilayer ceramic condenser.

### Claim 4 (depends on 1)

The substrate of claim 1, wherein the conductive material is an anisotropic conductive film or an anisotropic conductive paste.

### Claim 5 (depends on 1)

The substrate of claim 1, wherein the material molding the passive device is an epoxy resin.