# US 2010/0163282 A1 · Printed wiring board, method for manufacturing printed wiring board, and electric device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2010/0163282 A1 - Document ID: US20100163282A1 - Status: Published application - Kind: A1 - Application number: 12/376,862 - Filed: 2007-10-22 - Published: 2010-07-01 - Earliest claimed: 2006-10-24 - Assignees: Panasonic Corporation - Inventors: Hiroyoshi Tagi; Eiji Takahashi; Yoshiyuki Saito - Web page: https://patentgrep.com/patent/US20100163282A1 ## CPC - H05K 1/0228: {Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K1/0245)} - H05K 1/0245: {Lay-out of balanced signal pairs, e.g. differential lines or twisted lines} - H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)} - H05K 3/4614: {the electrical connections between the circuit boards being made during lamination} - H05K 3/4635: {laminating flexible circuit boards using additional insulating adhesive materials between the boards} - H05K 2201/055: Folded back on itself - H05K 2201/097: Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components - Y10T 29/49128: Assembling formed circuit to base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Provided are a printed wiring board and a flexible printed wiring board which hardly generate radiation electromagnetic noises and are not easily affected by external noises. First and second wave-shape wirings are provided between at least two insulation substrates stacked on each other. The first and the second wave-shape wirings three-dimensionally intersect with each other in a plane direction and a thickness direction of the insulating substrates. The first and second wave-shape wirings are electrically separated from each other by a resist layer provided between the insulating substrates. ## Claims ### Claim at position 1 1-24. (canceled) ### Claim 25 A printed wiring board comprising: at least three insulation substrates multilayered on one another; a first wave-shape wiring provided between the insulation substrates facing each other; a second wave-shape wiring provided between the insulation substrates facing each other and three-dimensionally intersecting with the first wave-shape wiring in a plane direction and a thickness direction of the insulation substrates; and a resist layer provided between the insulation substrates and electrically separating the first wave-shape wiring and the second wave-shape wiring from each other, wherein the first wave-shape wiring, the second wave-shape wiring and the resist layer are provided in each of a plurality of interlayer spaces of the insulation substrates, and the first wave-shape wirings adjacent to each other and the second wave-shape wirings adjacent to each other in the thickness direction of the insulation substrates are disposed at such positions that the first wave-shape wirings adjacent to each other and the second wave-shape wirings adjacent to each other are plane-symmetrical to each other relative to a bonding surface of the insulation substrates. ### Claim 26 (depends on 25) The printed wiring board as claimed in claim 25, wherein the first wave-shape wiring comprises: one or a plurality of first wiring patterns provided on one of facing surfaces of the insulation substrates facing each other and constituting intermittent portions in part in the first wave-shape wiring; one or a plurality of second wiring patterns provided on the other facing surface of the insulation substrates facing each other and constituting the remaining portions other than the portions of the first wiring pattern in the first wave-shape wiring; and a first electrical connection member provided between the insulation substrates facing each other and connecting the first wiring pattern and the second wiring pattern to each other along the thickness direction of the insulation substrates, and the second wave-shape wiring comprises: one or a plurality of third wiring patterns provided on one of facing surfaces of the insulation substrates facing each other and constituting intermittent portions in part in the second wave-shape wiring; one or a plurality of fourth wiring patterns provided on the other facing surface of the insulation substrates facing each other and constituting the remaining portions other than the portions of the third wiring pattern in the second wave-shape wiring; and a second electrical connection member provided between the insulation substrates facing each other and connecting the third wiring pattern and the fourth wiring pattern to each other along the thickness direction of the insulation substrates. ### Claim 27 (depends on 26) The printed wiring board as claimed in claim 26, wherein the first wiring pattern and the second wiring pattern serially connected to each other with the first electrical connection member interposed therebetween constitute the first wave-shape wiring, and the third wiring pattern and the fourth wiring pattern serially connected to each other with the second electrical connection member interposed therebetween constitute the second wave-shape wiring. ### Claim 28 (depends on 27) The printed wiring board as claimed in claim 27, wherein the first wiring pattern comprises a first parallel wiring portion and a first intersecting wiring portion, the second wiring pattern comprises a second parallel wiring portion and a second intersecting wiring portion, the third wiring pattern comprises a third parallel wiring portion and a third intersecting wiring portion, and the fourth wiring pattern comprises a fourth parallel wiring portion and a fourth intersecting wiring portion, the first parallel wiring portion and the fourth parallel wiring portion are in parallel with each other, and the second parallel wiring portion and the third parallel wiring portion are in parallel with each other when viewed from the thickness direction of the insulation substrates, the first intersecting wiring portion and the fourth intersecting wiring portion intersect with each other, and the second intersecting wiring portion and the third intersecting wiring portion intersect with each other when viewed from the thickness direction of the insulation substrates, the first intersecting wiring portion of the first wiring pattern is connected to the second parallel wiring portion of the second wiring pattern on one side adjacent to the first wiring pattern with the first electrical connection member interposed therebetween, and the first parallel wiring portion of the first wiring pattern is connected to the second intersecting wiring portion of the second wiring pattern on the other side adjacent to the first wiring pattern with the first electrical connection member interposed therebetween, and the third intersecting wiring portion of the third wiring pattern is connected to the fourth parallel wiring portion of the fourth wiring pattern on one side adjacent to the third wiring pattern with the second electrical connection member interposed therebetween, and the third parallel wiring portion of the third wiring pattern is connected to the fourth intersecting wiring portion of the fourth wiring pattern on the other side adjacent to the third wiring pattern with the second electrical connection member interposed therebetween. ### Claim 29 (depends on 28) The printed wiring board as claimed in claim 28, wherein when viewed from the thickness direction of the insulation substrates, the first parallel wiring portion and the second parallel wiring portion are disposed on substantially the same line, and the third parallel wiring portion and the fourth parallel wiring portion are disposed on substantially the same line. ### Claim 30 (depends on 29) The printed wiring board as claimed in claim 29, wherein when viewed from the thickness direction of the insulation substrates, the first intersecting wiring portion and the third intersecting wiring portion are in parallel with each other, and the second intersecting wiring portion and the fourth intersecting wiring portion are in parallel with each other. ### Claim 31 (depends on 25) The printed wiring board as claimed in claim 25, wherein signals in which phases are electrically different from each other through 180 degrees are driven in the first wave-shape wiring and the second wave-shape wiring. ### Claim 32 (depends on 26) The printed wiring board as claimed in claim 26, wherein any of a thermally-bonding portion between the first wiring pattern and the second wiring pattern, solder, a conductive adhesive and conductive paste constitutes the first electrical connection member, and any of a thermally-bonding portion between the third wiring pattern and the fourth wiring pattern, solder, conductive adhesive and conductive paste constitutes the second electrical connection member. ### Claim 33 (depends on 25) The printed wiring board as claimed in claim 25, wherein the insulation substrates adjacent to each other are coupled with each other at one of both ends thereof, and the coupling sections of the insulation substrates are alternately provided at one of both ends thereof, so that the plurality of insulation substrates have a shape of a bent insulation sheet. ### Claim 34 (depends on 33) The printed wiring board as claimed in claim 33, wherein the insulation substrate is a flexible substrate. ### Claim 35 (depends on 33) The printed wiring board as claimed in claim 33, wherein auxiliary wirings are provided at sections facing each other on the facing surfaces of the insulation substrates constituting an interlayer space between the insulation substrates where the first wave-shape wiring and the second wave-shape wiring are not provided, and these auxiliary wirings are connected, so that the insulation substrates are bonded to each other. ### Claim 36 (depends on 35) The printed wiring board as claimed in claim 35, wherein the auxiliary wirings are connected to a reference potential of the printed wiring substrate. ### Claim 37 A printed wiring board manufacturing method comprising: a first step in which at least three insulation substrates multilayered on one another including first and second insulation substrates are prepared, one or a plurality of first wiring patterns constituting intermittent portions in part in a first wave-shape wiring and one or a plurality of third wiring patterns constituting of intermittent portions in part in a second wave-shape wiring are formed on the first insulation substrate, and one or a plurality of second wiring patterns constituting the remaining portions other than the portions of the first wiring pattern in the first wave-shape wiring and one or a plurality of fourth wiring patterns constituting the remaining portions other than the portions of the third wiring pattern in the second wave-shape wiring are formed on the second insulation substrate; and a second step in which the first insulation substrate and the second insulation substrate are stacked on each other with a resist layer interposed therebetween so that surfaces thereof on which the wiring patterns are formed face each other, and the first wiring pattern and the second wiring pattern are connected to each other with a first electrical connection member interposed therebetween so that the first wave-shape wiring is formed, and the third wiring pattern and the fourth wiring pattern are connected to each other with a second electrical connection member interposed therebetween so that the second wave-shape wiring is formed in such a way that the second wave-shape wiring three-dimensionally intersects with the first wave-shape wiring in a plane direction and a thickness direction of the first and second insulation substrates, wherein in the first step, the first wave-shape wiring, the second wave-shape wiring and the resist layer are formed in each of a plurality of interlayer spaces of the insulation substrates, and the first wave-shape wirings adjacent to each other and the second wave-shape wirings adjacent to each other in the thickness direction of the insulation substrates are formed at such positions that the first wave-shape wirings adjacent to each other and the second wave-shape wirings adjacent to each other are plane-symmetrical to each other relative to a bonding surface of the insulation substrates. ### Claim 38 (depends on 37) The printed wiring board manufacturing method as claimed in claim 37, wherein the first wiring pattern and the second wiring pattern are serially connected to each other with the first electrical connection member interposed therebetween so that the first wave-shape wiring is formed, and the third wiring pattern and the fourth wiring pattern are serially connected to each other with the second electrical connection member interposed therebetween so that the second wave-shape wiring is formed in the second step. ### Claim 39 (depends on 38) The printed wiring board manufacturing method as claimed in claim 38, wherein the first wiring pattern comprising a first parallel wiring portion and a first intersecting wiring portion, the second wiring pattern comprising a second parallel wiring portion and a second intersecting wiring portion, the third wiring pattern comprising a third parallel wiring portion and a third intersecting wiring portion, and the fourth wiring pattern comprising a fourth parallel wiring portion and a fourth intersecting wiring portion are formed at positions where the first parallel wiring portion and the fourth intersecting wiring portion are in parallel with each other, the second parallel wiring portion and the third intersecting wiring portion are in parallel with each other, the first intersecting wiring portion and the fourth intersecting wiring portion intersect with each other, and the second intersecting wiring portion and the third intersecting wiring portion intersect with each other when viewed from the thickness direction of the insulation substrates in the first step, and the first intersecting wiring portion of the first wiring pattern is connected to the second parallel wiring portion of the second wiring pattern on one side adjacent to the first wiring pattern with the first electrical connection member interposed therebetween, the first parallel wiring portion of the first wiring pattern is connected to the second intersecting wiring portion of the second wiring pattern on the other side adjacent to the first wiring pattern with the first electrical connection member interposed therebetween, the third intersecting wiring portion of the third wiring pattern is connected to the fourth parallel wiring portion of the fourth wiring pattern on one side adjacent to the third wiring pattern with the second electrical connection member interposed therebetween, and the third parallel wiring portion of the third wiring pattern is connected to the fourth intersecting wiring portion of the fourth wiring pattern on the other side adjacent to the third wiring pattern with the second electrical connection member interposed therebetween in the second step. ### Claim 40 (depends on 39) The printed wiring board manufacturing method as claimed in claim 39, wherein when viewed from the thickness direction of the insulation substrates, the first parallel wiring portion and the third parallel wiring portion are formed on substantially the same line, and the second parallel wiring portion and the fourth parallel wiring portion are formed on substantially the same line in the first step. ### Claim 41 (depends on 40) The printed wiring board manufacturing method as claimed in claim 40, wherein the first intersecting wiring portion and the third intersecting wiring portion are formed in parallel with each other, and the second intersecting wiring portion and the fourth intersecting wiring portion are formed in parallel with each other when viewed from the thickness direction of the insulation substrates in the first step. ### Claim 42 (depends on 37) The printed wiring board manufacturing method as claimed in claim 37, wherein a sheet-shape insulation substrate obtained in such a way that the insulation substrates are coupled with each other at one of both ends of the insulation substrates adjacent to each other, and the coupling sections of the insulation substrates are alternately provided at one of both ends thereof so that the plurality of insulation substrates are formed into a sheet shape is prepared as the insulation substrates in the first step. ### Claim 43 (depends on 42) The printed wiring board manufacturing method as claimed in claim 42, wherein a flexible substrate is used as the insulation substrate in the first step. ### Claim 44 (depends on 42) The printed wiring board manufacturing method as claimed in claim 42, wherein auxiliary wirings are formed at sections facing each other on facing surfaces of the insulation substrates constituting an interlayer space between the insulation substrates where the first wave-shape wiring and the second wave-shape wiring are not provided in the first step, and these auxiliary wirings are connected so that the insulation substrates are bonded to each other in the second step. ### Claim 45 A flexible printed wiring board manufacturing method comprising steps of: forming a wiring pattern on a base film having an electrical insulation property and plasticity; forming an epoxy-based resin film having photosensitivity and an electrical insulation property on the surface of the base film on which the wiring pattern is formed, and removing the resin film in a section of the wiring pattern and a section of an end surface of the base film; providing a conductive material in the section of the wiring pattern from which the resin film is removed; and bending the base film with the section of the end surface of the base film from which the resin film is removed as a folding base point so that the surface on which the wiring pattern is formed is directed inward, and then electrically connecting the sections of the wiring pattern from which the resin film is removed abutting each other when the base film is bent. ### Claim 46 (depends on 25) An electric device comprising: the printed wiring board as claimed in claim 25; and a signal source which drives signals in which phases are electrically different through 180 degrees in the first wave-shape wiring and the second wave-shape wiring.