Protecting integrity of data in multi-layered memory with data redundancy
AssigneeUnity Semiconductor Corporation
InventorRobert Norman
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AssigneeUnity Semiconductor Corporation
InventorRobert Norman
Estimating the term…
Systems, integrated circuits, and methods for protecting data stored in third dimensional vertically stacked memory technology are disclosed. An integrated circuit is configured to perform duplication of data disposed in multi-layered memory that can comprise two-terminal cross-point memory arrays fabricated BEOL on top of a FEOL logic layer that includes active circuitry for performing data operations (e.g., read, write, program, and erase) on the multi-layered memory. For example, the integrated circuit can include a first subset of BEOL memory layers configured to store data, a second subset of the BEOL memory layers configured to store a copy of the data from the first subset of memory layers, a FEOL redundancy circuit coupled to the first subset of the memory layers and the second subset of the memory layers, the redundancy circuit being configured to provide both a portion of the data and a copy of the portion of the data.
An apparatus, comprising:
An integrated circuit, comprising:
A method for non-volatile data redundancy, comprising:
Dependencies are inferred from the claim text.