Resin composition and molded article comprising the same
AssigneeSumitomo Chemical Company, Limited
InventorKoji KAMEO
Life of this patent
Estimating the term…
Abstract
A resin composition is provided which comprises 10 to 88% by mass of a propylene-based polymer (A) composed of 30 to 70% by mass of a propylene-based polymer (a) having a melt flow rate of 0.1 to 17 g/10 minutes measured at a temperature of 230° C. and a load of 21.18N and 30 to 70% by mass of a propylene-based polymer (b) having a melt flow rate of 80 to 300 g/10 minutes measured at a temperature of 230° C. and a load of 21.18N; 10 to 88% by mass of a polylactic acid-based resin (B); 1 to 50% by mass of an ethylene-based polymer having an epoxy group (C); and 1 to 50% by mass of an elastomer (D).
Claims4
A resin composition comprising
- 10 to 88% by mass of a propylene-based polymer (A) composed of 30 to 70% by mass of a propylene-based polymer (a) having a melt flow rate of 0.1 to 17 g/10 minutes measured at a temperature of 230° C. and a load of 21.18N and 30 to 70% by mass of a propylene-based polymer (b) having a melt flow rate of 80 to 300 g/10 minutes measured at a temperature of 230° C. and a load of 21.18N,
- 10 to 88% by mass of a polylactic acid-based resin (B),
- 1 to 50% by mass of an ethylene-based polymer having an epoxy group (C), and
- 1 to 50% by mass of an elastomer (D),
- provided that each of the aforesaid amounts of the propylene-based polymer (A), the polylactic acid-based resin (B), the ethylene-based polymer having an epoxy group (C), and the elastomer (D) is an amount relative to the total amount of these four components.
Dependencies are inferred from the claim text.