Low bake, low voc conductive primer
AssigneeThe Sherwin-Williams Company
InventorsBrian J. Wayton, Hong Ding, Michael W. Cox
Life of this patent
Estimating the term…
Abstract
The present invention provides for a sealer/primer that is generally cured at low bake temperatures. The composition utilizes a resin system to provide both conductivity and adhesion of the coating onto plastic substrates. The present invention uses a polyester, such as one that includes unsaturated polyester, in combination with other resins, including an acrylic, crosslinking agent and conductive pigment to create a conductive primer that can be cured at low temperatures. The composition can be applied through traditional application equipment, seals the surface of the substrate to which it is applied, and cures to an acceptable surface for further processing, such as painting.
Claims17
A method of priming and sealing a plastic substrate, comprising
- spraying onto the substrate a coating composition comprising,
- (a) resin system, wherein said resin system includes at least one hydroxy functional unsaturated polyester and at least one hydroxy functional acrylic polymer;
- (b) a crosslinker selected from the group consisting of amino resins and isocyanates;
- and
- (c) a conductive pigment;
- wherein said unsaturated polyester is unsaturated in the backbone of the polyester and does not undergo further crosslinking in the coating composition through its unsaturation.
Dependencies are inferred from the claim text.