Mounting structure of component of lighting device and method thereof

A method for mounting a component to a lighting device comprising the following steps:

• (a) application of metal bonding agent to surface of lighting-device base, wherein a first layer of metal bonding agent is applied to a surface of a lighting-device base;
• (b) connection of lighting-device base to positive electrode, wherein the lighting-device base of step (a) is electrically connected to a positive electrode of an external power source so as to make both the lighting-device base and the first metal bonding agent layer carrying positive charges;
• (c) connection metal film to negative electrode, wherein a metal film is electrically connected to a negative electrode of the external power source provided in step (b) to make the metal film carrying negative charges;
• (d) application of metal bonding agent to lighting array chip, wherein a second layer of metal bonding agent is applied to a bottom surface of a lighting array chip;
• (e) bonding lighting array chip and metal film, wherein the metal film of step (c) is positioned on and bonded to the lighting array chip of step (d);
• and
• (f) hot-pressing to bond lighting array chip and lighting-device base, wherein the lighting array chip to which the metal film is bonded in step (e) is pressed toward the first metal bonding agent layer of the lighting-device base to have a surface of the metal film positioned on and bonded to a surface of the first metal bonding agent layer;
• and causing instantaneous thermal fusion among the negatively charged metal film, the second metal bonding agent layer, and the first metal bonding agent layer that is set on the surface of the positively charged lighting-device base so as to securely bond the lighting array chip to the surface of the lighting-device base.