Tape circuit substrate with reduced size of base film
AssigneeSamsung Electronics Co., Ltd.
InventorsSang-Ho Park, Sa-Yoon Kang, Si-Hoon Lee
Life of this patent
Estimating the term…
Abstract
A tape circuit substrate includes a base film with first wiring and second wiring disposed on the base film. The first wiring extends into a chip mount portion through a first side and bends within the chip mount portion toward a second side. The second wiring extends into the chip mount portion through a third side and bends within the chip mount portion toward the second side. The first, second, and third sides are different sides of the chip mount portion. Thus, size and in turn cost of the base film are minimized by arranging wirings within the chip mount portion for further miniaturization of electronic devices, such as a display panel assembly, using the tape circuit substrate.
Claims17
A tape circuit substrate comprising:
- a base film;
- a first wiring, disposed on the base film, that extends into a chip mount portion through a first side and that bends within the chip mount portion toward a second side;
- a second wiring, disposed on the base film, that extends into the chip mount portion through a third side and that bends within the chip mount portion toward the second side;
- and
- a third wiring, disposed on the base film, that extends into the chip mount portion through a fourth side that is different from the first, second, and third sides,
- wherein the first, second, and third sides are different sides of the chip mount portion, and one of the first and second wiring is an input wiring.
A display panel assembly comprising:
- a display panel including:
- a substrate;
- a first and a second transmission wirings disposed on the substrate;
- and
- a semiconductor chip package comprising:
- a tape circuit substrate including:
- a base film;
- a first wiring, disposed on the base film, that extends into a chip mount portion through a first side and that bends within the chip mount portion toward a second side;
- and
- a second wiring, disposed on the base film, that extends into the chip mount portion through a third side and that bends within the chip mount portion toward the second side, wherein the first, second, and third sides are different sides of the chip mount portion;
- and
- a display panel driver chip mounted on the chip mount portion;
- wherein the first and second wirings of the tape circuit substrate couple the display panel driver chip to the first and second transmission wirings of the display pane.
A display panel assembly comprising:
- a display panel including:
- a substrate;
- a first and a second transmission wirings disposed on the substrate;
- and
- a semiconductor chip package comprising:
- a tape circuit substrate including:
- a base film;
- a first wiring, disposed on the base film, that extends into a chip mount portion through a first side and that bends within the chip mount portion toward a second side;
- a second wiring, disposed on the base film, that extends into the chip mount portion through a third side and that bends within the chip mount portion toward the second side;
- and
- a third wiring, disposed on the base film, that extends into the chip mount portion through a fourth side that is different from the first, second, and third sides;
- a display panel driver chip mounted on the chip mount portion;
- wherein the first, second, and third sides are different sides of the chip mount portion, and one of the first and second wiring is an input wiring.
Dependencies are inferred from the claim text.