Integrated circuit packages having shared die-to-die contacts and methods to manufacture the same
OwnerMohd Hanafi Mohd Saidinventor
Life of this patent
Estimating the term…
Abstract
Integrated circuit packages having shared die-to-die contacts and methods to fabricate the same are disclosed. A disclosed example integrated circuit package comprises a leadframe, a first die pad and a second die pad associated with the leadframe, and first and second integrated circuits associated with the first and second die pads, respectively. The package also includes a shared die-to-die contact externally exposed by a recess that extends laterally across a bottom surface of the leadframe between the first and second die pads. The first integrated circuit is electrically coupled to a first portion of the shared contact. The second integrated circuit is electrically coupled to a second portion of the shared contact.
Claims18
An integrated circuit package comprising:
- a leadframe;
- a first die pad and a second die pad associated with the leadframe;
- first and second integrated circuits associated with the first and second die pads, respectively;
- and
- a shared die-to-die contact externally exposed by a recess that extends laterally across a bottom surface of the leadframe between the first and second die pads, the first integrated circuit being electrically coupled to a first portion of the shared contact, and the second integrated circuit being electrically coupled to a second portion of the shared contact.
A method to fabricate an integrated circuit package having first and second integrated circuits, the method comprising:
- attaching the first integrated circuit to a first die pad of a first leadframe cell;
- attaching the second integrated circuit to a second die pad of a second leadframe cell, the second leadframe cell being adjacent to the first leadframe cell on opposite sides of a connecting bar;
- electrically coupling the first integrated circuit to a conductive block, the conductive block being located between the first and second leadframe cells;
- electrically coupling the second integrated circuit to the conductive block;
- encapsulating the first and second integrated circuits in a molding compound;
- and
- removing a spine of the connecting bar to expose a first surface of the conductive block to form an external contact.
An electronic circuit comprising:
- a circuit board;
- and
- an integrated circuit package mounted on the circuit board, the package comprising:
- a contact electrically coupled to the circuit board, the contact having a cross-section, the cross-section having at least one of a π shape, an inverted U shape, or an n shape, an inner portion of the π shape, the inverted U shape, or the n shape being externally exposed on a first surface of the integrated circuit package and
- first and second integrated circuits encapsulated in a molding compound, the first and second integrated circuits being electrically coupled to the contact.
Dependencies are inferred from the claim text.