Heat spreader
OwnerDavid Rowcliffe, William Joseph Yost, IIIinventors
Life of this patent
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Abstract
The present invention relates to a package comprising a plate formed from a diamond-composite material and a frame and its use as a lid or cavity lid in electronic packaging applications.
Claims32
A package comprising a plate of diamond material having first and second surfaces and a thickness, and at least one support member wherein said support member has a thickness, forms at least a portion of opposite edges of the plate and is formed from a material having a coefficient of thermal expansion at room temperature which is higher than that of the diamond material, a thermal conductivity at room temperature which is lower than that of the diamond material, a Young's modulus at room temperature which is lower than that of the diamond material and which, in use, allows movement of the plate of diamond material in a direction parallel to the plane of the diamond plate but prevents movement of the plate of diamond material in a direction perpendicular to the plane of the diamond plate such that thermal contact with a surface of a component to which the plate is attached is maintained over at least about 75% of the surface of the component.
An electronic assembly comprising:
- a substrate;
- a die;
- and
- a cavity lid in thermal contact with the die and the lid, wherein the cavity lid comprises a plate of diamond material having first and second surfaces and a thickness, and at least one support member wherein said support member has a thickness, forms at least a portion of opposite edges of the plate and is formed from a material having a coefficient of thermal expansion at room temperature which is higher than that of the diamond material, a thermal conductivity at room temperature which is lower than that of the diamond material, a Young's modulus at room temperature which is lower than that of the diamond material and which, in use, allows movement of the plate of diamond material in a direction parallel to the plane of the diamond plate but prevents movement of the plate of diamond material in a direction perpendicular to the plane of the diamond plate wherein the first surface of the plate is in thermal contact with the die, the support member is in thermal contact with the plate of diamond material and the substrate and, in use, thermal contact between the plate of diamond material and a surface of the die is maintained over at least about 75% of the surface of the die.
Dependencies are inferred from the claim text.