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US 2010/0149379 A1Published application
Image sensor with three-dimensional interconnect and ccd
OwnerJoseph R. Summa, John P. McCarteninventors
Life of this patent
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Abstract
An image sensor and associated image capture device and method include a sensing wafer with a plurality of charge storage elements. One or more floating diffusions are associated with the plurality of charge storage elements, and charge is transferred among the charge storage elements to the one or more floating diffusions. The one or more floating diffusions on the sensing wafer are electrically connected to support circuitry on a circuit wafer.
Claims20
An image sensor, comprising:
- a sensing wafer including a plurality of charge storage elements and one or more floating diffusions associated with the plurality of charge storage elements, wherein charge is transferred among the charge storage elements to the one or more floating diffusions;
- and
- a circuit wafer including support circuitry for the sensing wafer, wherein the one or more floating diffusions are electrically connected to the support circuitry.
An image capture device, comprising:
- an imaging stage configured to receive light forming an image;
- an image sensor receiving light from the imaging stage, the image sensor including:
- a sensing wafer including a plurality of charge storage elements and one or more floating diffusions associated with the plurality of charge storage elements, wherein charge is transferred among the charge storage elements to the one or more floating diffusions;
- and
- a circuit wafer including support circuitry for the sensing wafer, wherein each floating diffusion on the sensing wafer is electrically connected to the support circuitry;
- and
- a memory configured to store the received image.
4 more elements
An image sensing method, comprising:
- collecting a charge in response to received light;
- transferring the charge among a plurality of charge storage elements to one or more floating diffusions on a sensor wafer;
- and
- sensing the charge using support circuitry on a circuit wafer electrically connected to the sensing wafer.
1 more element
Dependencies are inferred from the claim text.