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US 2010/0148910 A1Published application
Electronic circuit device
AssigneeSanken Electric Co., Ltd.
InventorRyuji TAKADA
Life of this patent
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Abstract
An electronic circuit device 1 arranged with a first substrate 11, a core 33 (magnetic body) mounted on the first substrate 11, a resin sealing body 17 which covers the first substrate 11 and the core 33, and a curable type stress relieving material 35 which reduces stress applied to the core 33 by the resin sealing body 17 is arranged within the resin sealing body 33 from the side surface periphery of the core 33 across to the first substrate 11.
Claims12
An electronic circuit device comprising:
- a substrate;
- a magnetic body mounted on the substrate;
- a resin sealing body which covers the substrate and the magnetic body;
- and
- a curable stress relieving material which reduces stress applied to the magnetic body by the resin sealing body, is arranged from a periphery of a side surface of the magnetic body across the substrate within the resin sealing body.
2 more elements
An electronic circuit device comprising:
- a substrate;
- electronic parts having a core formed from a stacked substrate arranged with a winding wire, and a magnetic body wedged in a part of the stacked substrate, the electronic parts being mounted on the substrate;
- a resin sealing body which covers the substrate and the electronic parts;
- and
- a curable stress relieving material which reduces stress applied to the core by the resin sealing body, is arranged from the periphery of a side surface of electronic parts across the substrate within the resin sealing body.
2 more elements
Dependencies are inferred from the claim text.