High energy density inductor

A winding for use in an inductor, comprising:

• a first substrate layer having a first side and a second side;
• a second substrate layer having a first side and a second side, wherein the second side of the second substrate layer is disposed adjacent to the second side of the first substrate layer to form an electrically isolated cooling channel therebetween, and wherein each of the first and the second substrate layers comprises:
• one or more traces disposed on a corresponding first side of the substrate layers, wherein the one or more traces are configured to facilitate conduction of current in the winding of the inductor;
• a sealing layer disposed on a corresponding second side of substrate layers, wherein the sealing layer is configured to provide a sealing border for the electrically isolated cooling channel;
• and
• an interconnect foil disposed on the second side of the substrate layers, wherein the interconnect foil is configured to facilitate operationally coupling the first substrate layer to the second substrate layer.

A winding for use in an inductor, comprising:

• a first substrate layer having a first side and a second side, wherein the first substrate layer comprises one or more traces disposed on the first side of the first substrate layer, and wherein the one or more traces are configured to facilitate conduction of current in the winding of the inductor;
• a second substrate layer having a first side and a second side;
• a sealing layer disposed on the first side of the second substrate layer, wherein the sealing layer is configured to provide a sealing border for an electrically isolated cooling channel;
• and
• an interconnect foil disposed on the first side of the second substrate layer, wherein the interconnect foil is configured to facilitate operationally coupling the first substrate layer to the second substrate layer.

An inductor, comprising:

• a core;
• a plurality of windings arranged along a first direction to form a stack, wherein each winding comprises:
• a first substrate layer;
• and
• a second substrate layer disposed adjacent to the first substrate layer to form an electrically isolated cooling channel therebetween.

A method for assembling an inductor, comprising:

• creating a plurality of windings, wherein each winding comprises a first substrate layer and a second substrate layer with an electrically isolated cooling channel therebetween;
• arranging the plurality of windings in a first direction to form a stack;
• coupling the plurality of windings in the stack;
• and
• arranging the stack of plurality of windings around a core to form the inductor.