High-frequency component having low dielectric losses

Abstract

The present invention relates to a high-frequency component with an internal conductor structure (2) which is electrically insulated by at least one insulation element (4, 5) relative to an external conductor, wherein the insulation element (4, 5) mechanically supports the internal conductor structure (2). The insulation element (4, 5) consists of a film (10) shaped to a three-dimensional structure and hardened with this three-dimensional structure by sintering, which film is a film of an electrically insulating material with a wall thickness which is smaller than a thickness of the insulation element (4, 5) realised by the three-dimensional structure. The insulation element of the proposed high-frequency component can be produced inexpensively and leads to a lower insertion loss for the component compared to components made from solid insulation elements.

Dependencies are inferred from the claim text.