Probe card for testing semiconductor device, probe card built-in probe system, and method for manufacturing probe card
OwnerJong Su KIMinventor
Life of this patent
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Abstract
A probe card is includes a wafer and a plurality of needle patterns penetrating the wafer. The needle patterns are configured to supply an electrical signal for testing a separate wafer. The probe card may be mounted to a printed circuit board in a manner in which conductive patterns of the probe card are electrically connected to conductive terminals of the printed circuit board. The needle patterns may protrude from a lower end of the wafer and be formed so that an interval between needle patterns is the same as an interval between pads of a wafer to be tested.
Claims20
A probe card for testing a semiconductor device comprising:
- a wafer;
- and
- a plurality of needle patterns configured to supply an electrical signal for testing, the needle patterns being formed inside the wafer such that the respective needles penetrate through the wafer.
A probe system, comprising:
- a probe card comprising:
- a wafer;
- a plurality of needle patterns configured to supply an electrical signal for testing, the needle patterns being formed inside the wafer such that the respective needle patterns penetrate through the inside of the wafer, wherein the respective needle patterns protrude a predetermined length outside of a first surface of the wafer;
- and
- a conductive pattern formed on a second surface of the wafer and electrically connected to the needle patterns;
- and
- a printed circuit board mounted so as to be electrically connected to the conductive pattern of the probe card.
A method for manufacturing a probe card for testing a semiconductor device, the method comprising:
- providing a wafer;
- forming a plurality of trenches in the wafer such that the trenches are spaced from each other by a predetermined interval;
- filling the trenches with a conductive material to form needle patterns for supplying an electrical signal for testing;
- and
- grinding a rear surface of the wafer to expose the needle patterns.
Dependencies are inferred from the claim text.