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US 2010/0148666 A1Published application
Encapsulant compositions and method for fabricating encapsulant materials
AssigneeIndustrial Technology Research Institute
InventorsLung-Chang Liu, Ming-Hua Chung, Tsung-Ju Hsu, Chih-Fen Chang, Jen-Hao Chen
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Abstract
An encapsulant composition is provided. The encapsulant composition includes at least one silicone resin monomer and at least one resin monomer selected from the group consisting of acrylic resin monomers and epoxy resin monomers, a filler of about 0.1-15 wt % of the encapsulant composition, and an initiator. The invention also provides a method for fabricating an encapsulant material.
Claims41
An encapsulant composition, comprising:
- at least one silicone resin monomer and at least one resin monomer selected from the group consisting of acrylic resin monomers and epoxy resin monomers;
- a filler of about 0.1-15 wt % of the encapsulant composition;
- and
- an initiator.
1 more element
A method for fabricating an encapsulant material, comprising:
- providing an encapsulant composition comprising at least one silicone resin monomer and at least one resin monomer selected from the group consisting of acrylic resin monomers and epoxy resin monomers, a filler and an initiator, wherein the filler is about 0.1-15 wt % of the encapsulant composition;
- and
- performing a heating process by a microwave source to polymerize the encapsulant composition.
Dependencies are inferred from the claim text.