Encapsulation structure and method of organic electroluminescence device

An encapsulation method, comprising:

• providing a first barrier layer;
• disposing a first adhesive on the first barrier layer;
• disposing an electroluminescence device on the first barrier layer disposed with the first adhesive, and the electroluminescence device comprising a substrate and an electroluminescence element both defining a lateral side, and the electroluminescence element comprising a first electrode disposed on the substrate, a second electrode, and an organic light-emitting layer disposed between the first and second electrodes;
• providing a second barrier layer;
• disposing a second adhesive on the second barrier layer;
• and
• assembling the second barrier layer disposed with the second adhesive onto the first barrier layer disposed with the first adhesive so that the first and second adhesives are coupled to each other, and one or more of the first and second adhesives are at least coupled to the lateral side of the electroluminescence device to seal the electroluminescence device between the first and second barrier layers.