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US 2010/0148377 A1Published application
Intermediate structure of semiconductor device and method of manufacturing the same
AssigneeElpida Memory, Inc.
InventorsYoukou ITO, Takashi Ohba
Life of this patent
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Abstract
An intermediate structure for semiconductor devices includes a wiring board, a plurality of semiconductor chips mounted on the wiring board, and a sealing body for collectively sealing the plurality of semiconductor chips and having a region with a different thickness.
Claims20
An intermediate structure for semiconductor devices comprising:
- a wiring board;
- a plurality of semiconductor chips mounted on the wiring board;
- and
- a sealing body for collectively sealing the semiconductor chips, the sealing body having a region with a different thickness.
1 more element
A method of manufacturing an intermediate structure for semiconductor devices, comprising:
- preparing a wiring board having a plurality of product formation portions;
- mounting a semiconductor chip on the product formation portions, respectively;
- and
- sealing the semiconductor chips collectively by using a molding device which has a cavity having various depths and injecting resin into the cavity so as to form a sealing body having a region with a different resin thicknesses.
1 more element
Dependencies are inferred from the claim text.