Method for low stress flip-chip assembly of fine-pitch semiconductor devices

A method for fabricating a device comprising the steps of:

• attaching one end of a columnar connector to the surface of a first body;
• dipping the unattached end of the connector and the contiguous connector portion into a paste made of metal and metal alloy particles dispersed in a binder of a first polymeric compound, thereby coating the dipped connector end with a film of the paste sleeving over the dipped connector portion;
• heating a second body to a first elevated temperature;
• bringing the film-coated connector end in contact with the second body to form an adhesive bond;
• filling, at the first elevated temperature, the space between the first and the second body with a precursor of a second polymeric compound different from the first polymeric compound to form a compact assembly;
• and
• heating the assembly to a second elevated temperature higher than the first temperature, thereby simultaneously polymerizing the second polymeric compound and at least partially sintering the metal and metal alloy particles into a metallic matrix with inclusions of the first polymeric compound.