Back to results
US 2010/0148372 A1Published application
Integrated circuit package having reduced interconnects
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, Jerry M. Brooks
Life of this patent
Estimating the term…
Abstract
A technique for making an integrated circuit package. Specifically, a stacked memory device is provided with minimal interconnects. Memory die are stacked on top of each other and electrically coupled to a substrate. Thru vias are provided in the substrate and/or memory die to facilitate the electrical connects without necessitating a complex interconnect technology between each of the interfaces. Wire bonds are used to complete the circuit package.
Claims20
An integrated circuit package comprising:
- a substrate having a front side and a backside and having connections extending through the substrate;
- a first die having a circuit side and a backside, wherein the circuit side has first conductive pads thereon and is adhesively coupled to the substrate, wherein the first conductive pads are coupled to the connections on the backside;
- and
- a second die having a circuit side and a backside and having second conductive pads on the circuit side, wherein the backside of the second die is adhesively coupled to the backside of the first die and the second conductive pads on the circuit side of the second die are coupled to the connections on the front side of the substrate.
1 more element
A system comprising:
- a processor;
- and
- an integrated circuit package coupled to the processor and comprising:
- a substrate having a front side and a backside and having connections extending through the substrate;
- a first die having a circuit side and a backside, wherein the circuit side has first conductive pads thereon and is adhesively coupled to the substrate, wherein the first conductive pads are coupled to the connections on the backside of the substrate;
- and
- a second die having a circuit side and a backside and having second conductive pads on the circuit side, wherein the backside of the second die is adhesively coupled to the backside of the first die and the second conductive pads on the circuit side of the second die are coupled to the connections on the front side of the substrate.
4 more elements
An integrated circuit package comprising:
- a substrate having a front side having first conductive pads thereon and a backside having second conductive pads thereon, the substrate having a slot therethrough, wherein the first conductive pads on the front side of the substrate are electrically coupled to the second conductive pads on the backside of the substrate by conductive paths extending through the substrate;
- a first die having a circuit side and a backside, wherein the circuit side has third conductive pads thereon and wherein the circuit side is adhesively coupled to the substrate such that the third conductive pads are aligned with the slot in the substrate and wherein the third conductive pads are coupled to the second conductive pads on the backside of the substrate;
- and
- a second die having a circuit side and a backside and having fourth conductive pads on the circuit side, wherein the backside of the second die is adhesively coupled to the backside of the first die and wherein the fourth conductive pads on the circuit side of the second die are coupled to the first conductive pads on the front side of the substrate.
1 more element
Dependencies are inferred from the claim text.