Via First Plus Via Last Technique for IC Interconnects
AssigneeQUALCOMM Incorporated
InventorsKenneth Kaskoun, Shiqun Gu, Bart Swinnen
Life of this patent
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Abstract
A multi-tiered IC device contains a first die including a substrate with a first and second set of vias. The first set of vias extends from one side of the substrate, and the second set of vias extend from an opposite side of the substrate. Both sets of vias are coupled together. The first set of vias are physically smaller than the second set of vias. The first set of vias are produced prior to circuitry on the die, and the second set of vias are produced after circuitry on the die. A second die having a set of interconnects is stacked relative to the first die in which the interconnects couple to the first set of vias.
Claims20
A multi-tiered integrated circuit (IC) device, comprising:
- a first die having a first set of vias and a second set of vias, the first set of vias extending into a substrate of the first die from a first side of the substrate, the second set of vias extending into the substrate from an opposite side of the substrate and coupling with the first set of vias, the first set of vias being manufactured prior to other circuitry of the die, the second set of vias being manufactured after other circuitry of the die is manufactured.
A process for manufacturing a multi-tiered integrated circuit device, comprising:
- providing a first die with a substrate having a first side and a second side facing away from the first side;
- manufacturing a first set of vias extending into the substrate from the first side of the substrate prior to manufacturing circuitry on the first die;
- and
- manufacturing a second set of vias extending into the substrate from the second side of the substrate after manufacturing circuitry on the first die.
Dependencies are inferred from the claim text.