Semiconductor device
AssigneeFujitsu Limited
InventorMotoyuki NISHIZAWA
Life of this patent
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Abstract
A semiconductor device where an outside connection terminal of a semiconductor element and an electrode of a wiring board are connected to each other via a conductive adhesive, the conductive adhesive includes a first conductive adhesive; and a second conductive adhesive covering the first conductive adhesive; wherein the first conductive adhesive contains a conductive filler including silver (Ag); and the second conductive adhesive contains a conductive filler including a metal selected from a group consisting of tin (Sn), zinc (Zn), cobalt (Co), iron (Fe), palladium (Pd), and platinum (Pt).
Claims8
A semiconductor device where an outside connection terminal of a semiconductor element and an electrode of a wiring board are connected to each other via a conductive adhesive, the conductive adhesive comprising:
- a first conductive adhesive;
- and
- a second conductive adhesive covering the first conductive adhesive;
- wherein the first conductive adhesive contains a conductive filler including silver (Ag);
- and
- the second conductive adhesive contains a conductive filler including a metal selected from a group consisting of tin (Sn), zinc (Zn), cobalt (Co), iron (Fe), palladium (Pd), and platinum (Pt).
Dependencies are inferred from the claim text.