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US 2010/0148367 A1Published application
Semiconductor device and method for fabricating the same
AssigneePanasonic Corporation
InventorsTakahiro MATSUO, Akio Furusawa, Shigeaki Sakatani
Life of this patent
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Abstract
A semiconductor device includes a die pad having a surface on which a first solder bonding layer is formed, and made of metal; and a semiconductor element fixed on the first solder bonding layer on the die pad by a solder material made mostly of bismuth. The first solder bonding layer is made of a softer material than the solder material, a recess is formed in a part of the first solder bonding layer by pressing the solder material against the first solder bonding layer, and the solder material partially fills the recess.
Claims12
A semiconductor device comprising:
- a die pad having a surface on which a first solder bonding layer is formed, and made of metal;
- and
- a semiconductor element fixed on the first solder bonding layer on the die pad by a solder material made mostly of bismuth,
- wherein the first solder bonding layer is made of a softer material than the solder material,
- a recess is formed in a part of the first solder bonding layer by pressing the solder material against the first solder bonding layer, and
- the solder material partially fills the recess.
3 more elements
Dependencies are inferred from the claim text.