Grid array connection device and method
AssigneeIntel Corporation
InventorsMunehiro Toyama, Siew Fong Tai, Kian Sin Sim, Charan K. Gurumurthy, Selvy Tamil Selvamuniandy
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Abstract
A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.
Claims15
A semiconductor chip grid array connection structure, comprising:
- a metallic electrical connection surface;
- a nickel layer coupled to the metallic connection surface;
- a palladium containing layer completely covering the nickel layer;
- and
- a gold layer coupled to the palladium containing layer.
A semiconductor chip grid array connection structure, comprising:
- a metallic electrical connection surface;
- a nickel layer coupled to the connection surface;
- a solder structure;
- and
- a SnNiCuP layer between the nickel layer and the solder structure.
A land grid array connection structure, comprising:
- a metallic electrical connection surface;
- a nickel layer coupled to the metallic connection surface;
- a palladium containing layer completely covering the nickel layer;
- and
- a gold layer coupled to the palladium containing layer, the gold layer having a thickness of approximately 50-80 nanometers.
Dependencies are inferred from the claim text.