Semiconductor device and method for fabricating the same
AssigneePanasonic Corparation
InventorDaisuke SAKURAI
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Abstract
A semiconductor device includes an electronic part including an electrode, a substrate including a substrate electrode electrically connected to the first electrode on an upper surface thereof, the first substrate electrode and the first electrode being arranged, facing each other, a connecting member configured to connect the electrode with the substrate electrode, and a sealing material including a first resin portion which contains flux and contacts at least a connection portion between the connecting member and the substrate electrode, and a second resin portion which contains a lower concentration of flux than that of the first resin portion. A gap between the electronic part and the substrate is filled with the sealing film.
Claims24
A semiconductor device comprising:
- a first electronic part including a first electrode;
- a first substrate including a first substrate electrode electrically connected to the first electrode on an upper surface thereof, wherein the first substrate electrode and the first electrode are arranged, facing each other;
- a first connecting member configured to connect the first electrode with the first substrate electrode;
- and
- a sealing material including a first resin portion which contains flux and contacts at least a first connection portion between the first connecting member and the first substrate electrode, and a second resin portion which does not contain the flux or contains a lower concentration of the flux than that of the first resin portion.
A method for fabricating a semiconductor device, comprising the steps of:
- (a) joining a sealing material including a first resin portion which contains flux and a second resin portion which does not contain the flux or contains a lower concentration of the flux than that of the first resin portion, with an upper surface of a first substrate on which a first substrate electrode is provided, so that the first resin portion is provided on or over the first substrate electrode, covering the first substrate electrode;
- (b) after step (a), mounting a first electronic part including a first electrode onto the first substrate so that the first electrode is positioned to face the first substrate electrode;
- and
- (c) after step (b), connecting the first electrode with the first substrate electrode using a first connecting member, and sealing at least the upper surface of the first substrate using the sealing material.
Dependencies are inferred from the claim text.