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US 2010/0148359 A1Published application
Package on Package Assembly using Electrically Conductive Adhesive Material
OwnerNanette Quevedo, Myung Jin Yiminventors
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Abstract
Packages are joined together using an anisotropic conductive material that includes an electrically insulative component and a plurality of electrically conductive particles. The electrically conductive particles may complete electrical connection between inter-package connectors and bond pads that may otherwise fail. The electrically insulative component may be cured to act as an underfill to provide mechanical connection between the packages.
Claims20
An integrated circuit assembly comprising:
- a first integrated circuit package;
- a second integrated circuit package;
- a plurality of inter-package connectors to electrically connect the first package to the second package;
- and
- a connection material comprising a compliant electrical insulator component and a plurality of electrically conductive components embedded in the electrical insulator component, wherein the plurality of electrically conductive components ensure electrical connection of the first package to the second package.
2 more elements
A method comprising:
- applying a connection material, which comprises a compliant electrical insulator component and a plurality of electrically conductive components embedded in the electrical insulator component, to a first package outside of a die;
- positioning a second package in alignment with the first package;
- and
- curing the connection material to provide an electrical connection between the first package and the second package through the connection material.
1 more element
A system comprising:
- an antenna;
- radio frequency circuit coupled to the antenna;
- and
- an integrated circuit coupled to the radio frequency circuit, the integrated circuit comprising:
- a memory package;
- a logic package;
- a plurality of inter-package connectors to electrically connect the memory package to the logic package;
- and
- a connection material comprising a compliant electrical insulator component and a plurality of electrically conductive components embedded in the electrical insulator component, wherein the plurality of electrically conductive components ensure electrical connection of the memory package to the logic package.
6 more elements
Dependencies are inferred from the claim text.