Semiconductor device with a high thermal dissipation efficiency
AssigneeInternational Business Machines Corporation
InventorsThomas J. Brunschwiler, Michel Despont, Mark A. Lantz, Bruno Michel, Peter Vettiger
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Abstract
A semiconductor device having a higher thermal dissipation efficiency includes a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
Claims9
A semiconductor device comprising:
- a thermally conducting structure formed on a carrier and attached to a surface of the semiconductor device via soldering, said thermally conducting structure being essentially formed of a thermally conducting material and comprising:
- a plurality of structural cooling elements of a high aspect ratio selected from a group consisting of:
- an array of freestanding fins, studs, and frames and a grid of connected fins;
- a very thin layer of soldering applied between the thermally conducting structure and the surface of the semiconductor device;
- wherein the very thin layer is less than 1 μm;
- a cooling liquid;
- a manifold layer for supplying the cooling liquid, said manifold layer comprising fluid inlets and outlets;
- an adhesion layer coating the surface of the semiconductor device for attaching the thermally conducting structure;
Dependencies are inferred from the claim text.