Method of packaging integrated circuit dies with thermal dissipation capability

An integrated circuit (IC) package comprising:

• a heat spreader substrate having a cavity formed in a top surface of said substrate, said cavity including a cavity floor;
• an IC die having a first surface and a second surface, said second surface of said IC die being attached to said cavity floor such that said first surface of said IC die and said top surface of said heat spreader substrate are substantially coplanar;
• and
• build-up layers formed over said top surface of said heat spreader substrate and said first surface of said IC die, said build-up layers including a dielectric material and an electrically conductive material, said build-up layers including electrical interconnects formed therein.

A method of packaging multiple integrated circuit (IC) dies with thermal dissipation capability, each of said multiple IC dies having a first surface and a second surface, and said method comprising:

• obtaining a heat spreader substrate having multiple cavities formed in a top surface of said substrate, each of said cavities including a cavity floor;
• for said each of said multiple IC dies, attaching said second surface to said cavity floor in one of said cavities such that said first surface of said each IC die and said top surface of said heat spreader substrate are substantially coplanar;
• forming build-up layers over said first surface of said each of said multiple IC dies, said build-up layers including a dielectric material and an electrically conductive material, said forming operation forming electrical interconnects over said first surface of said each of said multiple IC dies to form a panel of said multiple IC dies;
• and
• following said forming operation, separating said panel of said multiple IC dies to form individual IC packages each including a portion of said heat spreader substrate, at least one of said IC dies, and a section of said electrical interconnects.