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US 2010/0148356 A1Published application
Stacked semiconductor device and manufacturing method thereof
AssigneePanasonic Corporation
InventorTomohiro TAMAKI
Life of this patent
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Abstract
A semiconductor device includes: a first substrate; a second substrate provided over the first substrate, and divided into a plurality of portions; a cooling member provided in a gap between the divided second substrate portions on the first substrate; and a third substrate provided on the second substrate portions and the cooling member. For example, a heat pipe or the like is used as the cooling member.
Claims11
A stacked semiconductor device, comprising:
- a first substrate;
- a second substrate provided over the first substrate, and divided into a plurality of portions;
- a cooling member provided in a gap between the divided second substrate portions on the first substrate;
- and
- a third substrate provided on the second substrate portions and the cooling member.
2 more elements
A method for manufacturing a stacked semiconductor device, comprising the steps of:
- (a) placing a plurality of second substrates over a first substrate with a gap between the plurality of second substrates;
- (b) providing a cooling member in at least a part of the gap between the plurality of second substrates on the first substrate;
- and
- (c) placing a third substrate on the plurality of second substrates and the cooling member.
1 more element
Dependencies are inferred from the claim text.