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US 2010/0148355 A1Published application
Integrated circuit package system employing wafer level chip scale packaging
AssigneeSTATS ChipPAC, Ltd.
InventorsByung Tai Do, Heap Hoe Kuan
Life of this patent
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Abstract
An integrated circuit package system that includes: providing a substrate with a protective coating; attaching a labeling film to a support member in a separate process; joining the protective coating and the labeling film; and dicing the substrate, the protective coating, and the labeling film to form the integrated circuit package system.
Claims10
An integrated circuit package system comprising:
- a substrate with a first surface and a second surface;
- electrical conductors on the first surface of the substrate;
- a protective coating on the second surface of the substrate;
- and
- a labeling film on the protective coating.
2 more elements
Dependencies are inferred from the claim text.