Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsA Leam Choi, Jae Han Chung, DeokKyung Yang, HyungSang Park
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a through silicon via die having an interconnect through a silicon substrate; depositing a re-distribution layer on the through silicon via die and connected to the interconnects; mounting a structure over the through silicon via die; connecting the structure to the interconnect of the through silicon via die with a direct interconnect; and encapsulating the through silicon via die and partially encapsulating the structure with an encapsulation.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a through silicon via die having an interconnect through a silicon substrate;
- depositing a re-distribution layer on the through silicon via die and connected to the interconnects;
- mounting a structure over the through silicon via die;
- connecting the structure to the interconnect of the through silicon via die with a direct interconnect;
- and
- encapsulating the through silicon via die and partially encapsulating the structure with an encapsulation.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a through silicon via die having an interconnect through a silicon substrate;
- depositing a re-distribution layer on the through silicon via die and connected to the interconnects;
- mounting a structure over the through silicon via die;
- connecting the structure to the interconnect of the through silicon via die with a direct interconnect;
- encapsulating the through silicon via die and partially encapsulating the structure with an encapsulation;
- mounting an integrated circuit die between the structure and the through silicon via die;
- and
- connecting the integrated circuit die to the through silicon via die or the structure with an internal interconnect.
An integrated circuit packaging system comprising:
- a through silicon via die having an interconnect through a silicon substrate;
- a re-distribution layer deposited on the through silicon via die and connected to the interconnects;
- a structure mounted over the through silicon via die;
- a direct interconnect that connects the structure to the interconnect of the through silicon via die;
- and
- an encapsulation that encapsulates the through silicon via die and partially encapsulating the structure.
Dependencies are inferred from the claim text.