Method of packaging integrated circuit devices using preformed carrier
AssigneeMicron Technology, Inc.
InventorTan Kwang Hong
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Abstract
Disclosed is a method of packaging integrated circuit devices using a preformed carrier. In one illustrative embodiment, the method includes providing a carrier having a plurality of pockets formed therein, positioning an integrated circuit chip and a substrate in each of the plurality of pockets and conductively coupling the integrated circuit chip and the substrate in each of the plurality of pockets to one another. Also disclosed is a packaged integrated circuit device including a preformed body and an integrated circuit chip and a substrate positioned within the preformed body, the integrated chip and the substrate being conductively coupled to one another.
Claims20
A packaged integrated circuit device, comprising:
- a preformed body;
- and
- an integrated circuit chip and a substrate positioned within said preformed body, said integrated chip and said substrate being conductively coupled to one another.
A packaged integrated circuit device, comprising:
- a preformed body comprising a first recess and a second recess;
- an integrated circuit chip positioned in said first recess;
- a substrate positioned within said second recess;
- and
- a plurality of wire bonds conductively coupled to said integrated circuit chip and said substrate.
Dependencies are inferred from the claim text.