Semiconductor Package Having Support Chip And Fabrication Method Thereof

A fabrication method of a semiconductor package, comprising:

• preparing a circuit substrate having a conductive pattern provided on a top surface thereof, wherein the conductive pattern includes a plurality of conductive elements;
• attaching a first semiconductor die onto a top surface of the circuit substrate, wherein the first semiconductor die has a plurality of bond pads on a top surface thereof;
• attaching a second semiconductor die attached onto a top surface of the first semiconductor die, wherein the second semiconductor die has a plurality of bond pads on a top surface thereof;
• attaching at least one support chip onto a top surface of the first semiconductor die, wherein the semiconductor chip has a plurality of bond pads provided on a top surface thereof;
• electrically connecting the first semiconductor die to the circuit substrate, the second semiconductor die to the circuit substrate, the second semiconductor die to the support chip, the bond pads of the support chip to each other, and the support chip to the circuit substrate by conductive wires;
• and
• encapsulating the first semiconductor die, the second semiconductor die, the support chip, and the conductive wires.