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US 2010/0148345 A1Published application
Electronic devices including flexible electrical circuits and related methods
OwnerHelmut Eckhardt, Stefan Uferinventors
Life of this patent
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Abstract
A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.
Claims40
A packaged electronic device, comprising:
- a die comprising a substrate including a first substrate surface and an opposing second substrate surface, die circuitry formed on the substrate, and a plurality of electrical contacts located on the first substrate surface and communicating with the die circuitry;
- a flexible circuit structure bonded directly to the die, the flexible circuit structure comprising:
- a first structural layer bonded directly to the first substrate surface and having a plurality of first openings respectively aligned with the plurality of electrical contacts;
- a plurality of electrical conductors, each electrical conductor disposed on the first structural layer and extending through a respective first opening into contact with a respective electrical contact;
- and
- a second structural layer disposed on the electrical conductors and having a plurality of second openings defining a respective exposed areas on the electrical conductors,
- wherein the electrical contacts and the electrical conductors are encapsulated by the first structural layer and the second structural layer;
- and
- a barrier film disposed on the die, wherein the electronic device is encapsulated by the barrier film and one or more of the first structural layer and the second structural layer.
6 more elements
A method for fabricating a packaged electronic device, the method comprising:
- fabricating a flexible circuit structure on a first substrate surface of a substrate by:
- depositing a first structural layer on the first substrate surface wherein the first structural layer is bonded directly to the first substrate surface;
- forming a plurality of electrical conductors on the first structural layer and in signal communication with die circuitry of the substrate;
- and
- depositing a second structural layer on the electrical conductors,
- wherein the electrical conductors are encapsulated by the first structural layer and the second structural layer, and the flexible circuit structure in combination with the substrate forms an electronic device;
- and
- depositing a barrier film on a second substrate surface of the substrate opposite to the first substrate surface, and on an outer lateral surface of the substrate extending generally between the first substrate surface and the second substrate surface, wherein the electronic device is encapsulated by the barrier film and one or more of the first structural layer and the second structural layer.
5 more elements
Dependencies are inferred from the claim text.