Process for fabricating a semiconductor component support, support and semiconductor device

An electrical connection support configured to receive at least one semiconductor component, comprising:

• a plate having electrical connection pads on a surface;
• a stand-off structure comprising a supplementary layer on top of one zone of said surface and outside of a place on that surface which is configured to receive at least one semiconductor component;
• and
• electrical connection vias formed through the supplementary layer, these vias being electrically connected to said electrical connection pads of the plate and having outer faces for external electrical connection.

A semiconductor device, comprising:

• a support, comprising:
• a plate having electrical connection pads on a surface;
• a stand-off structure comprising a supplementary layer on top of one zone of said surface and outside of a place on that surface which is configured to receive at least one semiconductor component;
• and
• electrical connection vias formed through the supplementary layer, these vias being electrically connected to said electrical connection pads of the plate and having outer faces for external electrical connection;
• and
• at least one semiconductor component mounted on said place of the plate of the support.

An assembly, comprising:

• a first semiconductor device including:
• a first support, comprising:
• a first plate having first electrical connection pads on a top surface;
• a stand-off structure comprising a supplementary layer on top of one zone of said top surface and outside of a place on that top surface which is configured to receive at least one semiconductor component;
• and
• electrical connection vias formed through the supplementary layer, these vias being electrically connected to said first electrical connection pads of the plate and having outer faces for external electrical connection;
• and
• at least one semiconductor component mounted on said place of the plate of the first support;
• a second semiconductor device, comprising:
• a second support, comprising:
• a second plate having second electrical connection pads on a rear surface;
• and
• at least one other semiconductor component mounted on the second plate;
• and
• electrical connections between the first electrical connection pads of the first support and the second electrical connection pads of the second support, wherein the electrical connections comprise the electrical connection vias of the stand-off structure.