Semiconductor package, method of manufacturing same, semiconductor device and electronic device

Abstract

A highly reliable semiconductor package in which faulty connections do not occur even when an external substrate is curved. The semiconductor package includes a semiconductor chip 1; an interposer substrate 10 arranged so as to enclose the semiconductor chip and having a first electrode pad 14, which is for connecting to an electrode of the semiconductor chip, provided on a wiring layer 12 disposed between insulating layers 11, 13; and a first conductor 2 for connecting the electrode of the semiconductor chip and the electrode pad. A portion of the underside of the interposer substrate 10 is adhered to the interposer substrate 10. A gap 4 is provided between the semiconductor chip 1 and the interposer substrate 10 on the side surface of the semiconductor chip 1. When a substrate 20 on which the semiconductor package has been mounted is made to curve, the gap 4 is arranged at least on the underside of the semiconductor chip 1 and a state is attained in which the interposer substrate 10 departs from the underside of the semiconductor chip 1.

Dependencies are inferred from the claim text.