Packaging millimeter wave modules
AssigneeFreescale Semiconductor, Inc.
InventorJINBANG TANG
Life of this patent
Estimating the term…
Abstract
A module, which in one embodiment may be a packaged millimeter waver module, includes a semiconductor lid portion; a packaging portion attached to the lid portion, wherein the packaging portion comprises a plurality of vias, a carrier portion, wherein a first semiconductor die is attached to the carrier portion, the packaging portion is attached to the carrier portion so that the packaging portion is over the carrier portion and the semiconductor die is within an opening in the packaging portion, and the lid portion and the carrier portion form an first air gap around the first semiconductor device.
Claims20
A module comprising:
- a semiconductor lid portion;
- a packaging portion attached to the lid portion, wherein the packaging portion comprises a plurality of vias;
- a carrier portion, wherein:
- a first semiconductor die is attached to the carrier portion;
- the packaging portion is attached to the carrier portion so that the packaging portion is over the carrier portion and the semiconductor die is within an opening in the packaging portion;
- and
- the lid portion and the carrier portion form an first air gap around the first semiconductor device.
The module of claim 3, wherein the plurality of vias is farther from the edge of the module than the first semiconductor die.
A module comprising:
- a first substrate, wherein the first substrate is a semiconductor substrate;
- a second substrate over the first substrate, wherein the second substrate comprises:
- a plurality of vias embedded in a dielectric region;
- a plurality of interconnects under at least a portion of the plurality of vias and coupled to the at least a portion of the plurality of vias;
- a third substrate over the second substrate;
- and
- a first semiconductor die between the first substrate and the third substrate, wherein at least one surface of the first semiconductor die is in contact with air.
A method of forming a module comprising:
- providing a first substrate;
- providing a second substrate, wherein the second substrate comprises a plurality of vias embedded in a dielectric layer;
- providing a third substrate;
- attaching a semiconductor die to the third substrate;
- attaching the second substrate to the third substrate so that the second substrate is over the third substrate and the semiconductor die is within an opening in the second substrate;
- and
- attaching the first substrate to the second substrate so that the first substrate and the third substrate form and air gap around the semiconductor device.
Dependencies are inferred from the claim text.