Semiconductor apparatus and manufacturing method thereof
AssigneeShinko Electric Industries Co., Ltd.
InventorAtsunori Kajiki
Life of this patent
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Abstract
A semiconductor apparatus includes a first wiring substrate, a second wiring substrate, a semiconductor chip, an adhesive layer and a molding resin. The second wiring substrate is stacked and connected on the first wiring substrate through a bump electrode. The semiconductor chip is mounted on the first wiring substrate by flip chip bonding and received between the first wiring substrate and the second wiring substrate. An upper surface of the semiconductor chip is subject to a mirror treatment. The adhesive layer is formed on the upper surface of the semiconductor chip. The molding resin is filled in a gap between the first wiring substrate and the second wiring substrate.
Claims10
A semiconductor apparatus comprising:
- a first wiring substrate;
- a second wiring substrate which is stacked and connected on the first wiring substrate through a bump electrode;
- a semiconductor chip which is mounted on the first wiring substrate by flip chip bonding and received between the first wiring substrate and the second wiring substrate, an upper surface of the semiconductor chip being subject to a mirror treatment;
- an adhesive layer which is formed on the upper surface of the semiconductor chip;
- and
- a molding resin which is filled in a gap between the first wiring substrate and the second wiring substrate.
A manufacturing method of a semiconductor apparatus, comprising steps of:
- mounting a semiconductor chip, an upper surface of which is subject to a mirror treatment, on a first wiring substrate by flip chip bonding;
- forming an adhesive layer on the upper surface of the semiconductor chip;
- receiving the semiconductor chip between the first wiring substrate and a second wiring substrate by stacking the second wiring substrate on the first wiring substrate through a bump electrode;
- and
- filling a gap between the first wiring substrate and the second wiring substrate with a molding resin by a transfer molding construction method.
Dependencies are inferred from the claim text.