Semiconductor devices including semiconductor dice in laterally offset stacked arrangement
AssigneeRound Rock Research, LLC
InventorsLeonard E. Mess, Jerry M. Brooks, David J. Corisis
Life of this patent
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Abstract
A semiconductor device assembly includes two or more dice stacked in laterally offset arrangement relative to one another. With such an arrangement, when a second semiconductor die is positioned over a first semiconductor die, bond pads of the first semiconductor die are exposed laterally beyond the second semiconductor die. The semiconductor dice of such an assembly may have similar dimensions and bond pad arrangements. In some embodiments the bond pads of each semiconductor die may be located on the active surface, along a single edge. The multiple chip device enables stacking of a plurality of semiconductor dice in a high density, low profile device.
Claims54
A memory device, comprising:
- a substrate comprising conductive material;
- a first die including a first set of bond pads along a front edge on a top surface of the first die, wherein the first die is adhered to the substrate;
- a second die, having the same dimensions as the first die, including a second set of bond pads along a front edge on a top surface of the second die, wherein the front edge of the second die is oriented adjacent to the front edge of the first die, the second die is adhered to the top surface of the first die, and the second die is laterally offset from the first die to expose the first set of bond pads;
- a first bond wire physically coupled between the first die and the substrate;
- a second bond wire physically coupled between the second die and the substrate;
- and
- encapsulating material encapsulating the first and second dice and the first and second bond wires.
A packaged semiconductor device, comprising:
- a substrate comprising metallization;
- a first die including a first set of bond pads, wherein the first die is joined to the substrate by an adhesive;
- a second die, having the same dimensions as the first die, including a second set of bond pads, the second die joined to the first die by an adhesive and offset from the first die in a forward direction;
- a third die, having the same dimensions as the first die, including a third set of bond pads, wherein the third die is disposed above the second die;
- a fourth die, having the same dimensions as the first die, including a fourth set of bond pads, the fourth die joined to the third die by an adhesive and offset from the third die in a forward direction, wherein the first, second, third, and fourth sets of bond pads face the same direction;
- respective bond wires of a plurality of bond wires to join at least one bond pad of the first set of bond pads to the metallization, at least one bond pad of the second set of bond pads to the metallization, at least one bond pad of the third set of bond pads to the metallization, and at least one bond pad of the fourth set of bond pads to the metallization;
- and
- encapsulant to enclosing the first, second, third, and fourth dice and the plurality of bond wires.
A device, comprising:
- a package substrate;
- a first die disposed above the substrate and including a first set of bond pads;
- a second die, having the same dimensions and bond pad layout as the first die, disposed above and attached to the first die and including a second set of bond pads, wherein the second die is offset from the first die in a forward direction to expose the first set of bond pads and the first and second sets of bond pads are oriented in the same direction;
- a third die, having different dimensions and different bond pad layout than the first die, disposed above the package substrate and including a third set of bond pads;
- a first bond wire bonded between a bond pad of the first set of bond pads and the substrate;
- a second bond wire bonded between a bond pad of the second set of bond pads and the substrate;
- a third bond wire bonded between a bond pad of the third set of bond pads and the substrate;
- and
- a material that encapsulates the first, second, and third dice.
Dependencies are inferred from the claim text.