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US 2010/0148330 A1Published application
Leadless package housing
AssigneeRobert Bosch GmbH
InventorRicardo Ehrenpfordt
Life of this patent
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Abstract
A leadless package for semiconductor elements has at least two semiconductor elements which are situated on a connection region of a lead frame of the leadless package in such a way that when deformations of the semiconductor elements occur, the deformations of the semiconductor elements compensate one another.
Claims13
A leadless package for packaging semiconductor elements, comprising:
- a lead frame having a connection region;
- and
- at least two semiconductor elements situated on the connection region of the lead frame in such a way that, in the event of deformations of the at least two semiconductor elements, the deformations of the at least two semiconductor elements at least partially compensate one another.
Dependencies are inferred from the claim text.