Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same

A method of manufacturing a semiconductor die package, the method of comprising:

• assembling a leadframe, at least one semiconductor die, and a heat sink member together, the leadframe having a first surface, a second surface opposite to its first surface, a die attach region, a tab disposed adjacent the die attach region, and at least one lead electrically coupled to the tab, the at least one semiconductor die having a first surface, a second surface opposite to its first surface, a first electrode disposed on the die's first surface, and a second electrode disposed on the die's second surface, the die's first surface being disposed on the leadframe's die attach region with the die's first electrode being electrically coupled to the die attach region by a body of electrically conductive adhesive, the heat sink member having an electrically insulating substrate with a first surface and a second surface, an electrically conductive layer disposed on the substrate's first surface, and a heat conducting layer disposed on the substrate's second surface, the heat sink member being disposed over the second surface of the semiconductor die and the tab of the leadframe with the electrically conductive layer having a first portion electrically coupled to the die's second electrode and a second portion electrically coupled to the leadframe's tab;
• and
• disposing a body of electrically insulating material disposed between the heat sink member and the leadframe and adhered to the heat sink member and the leadframe.