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US 2010/0148315 A1Published application
Semiconductor wafer and a method of separating the same
AssigneePanasonic Corporation
InventorsTakahiro KUMAKAWA, Hideki KOJIMA, Tomoaki FURUKAWA
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Abstract
A semiconductor wafer includes a plurality of predetermined separation lines extending from an upper surface to a bottom surface; and a semiconductor substrate including a plurality of chip regions segmented by the predetermined separation lines. Tensile stress is applied to regions of the semiconductor substrate provided with the predetermined separation lines.
Claims13
A semiconductor wafer, where a plurality of predetermined separation lines are provided, comprising:
- a semiconductor substrate including a plurality of chip regions segmented by the predetermined separation lines, wherein
- tensile stress is applied to regions of the semiconductor substrate provided with the predetermined separation lines.
A method of separating a semiconductor wafer comprising the steps of:
- (a) preparing a wafer;
- in which a plurality of predetermined separation lines are provided, which includes a semiconductor substrate including a plurality of chip regions segmented by the predetermined separation lines, and in which tensile stress is applied to regions of the semiconductor substrate provided with the predetermined separation lines;
- (b) irradiating with laser light, an inside of the semiconductor substrate along the predetermined separation lines to form a plurality of modified regions in a depth direction;
- and
- (c) separating the semiconductor substrate into the individual chip regions along cracks generated from the modified regions.
2 more elements
Dependencies are inferred from the claim text.