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US 2010/0148312 A1Published application
Reinforced smart cards & methods of making same
AssigneeIVI Smart Technologies, Inc.
InventorMATTHEW JUNG
Life of this patent
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AssigneeIVI Smart Technologies, Inc.
InventorMATTHEW JUNG
Estimating the term…
Reinforced smart cards with and methods of making an integrated circuit chip for smart are disclosed. In some embodiments, a method includes generally providing an integrated circuit wafer including a plurality of integrated circuits, providing a stiffener, attaching the stiffener top surface to the wafer bottom surface, and physically separating integrated circuits. The wafer can be substantially disc-shaped with a wafer perimeter. Integrated circuits can be disposed on the wafer's top surface, and the wafer's bottom surface can span a wafer bottom area. The stiffener can have a top surface spanning an area corresponding to a circuitry portion of the wafer's top surface (where integrated circuits can be disposed). The stiffener's can be applied to the wafer's bottom surface to form a wafer/stiffener assembly. Integrated circuits of the wafer/stiffener assembly can be separated by removing wafer material between integrated circuits and stiffener material between regions of the stiffener underlying the integrated circuits. Other aspects, features, and embodiments are claimed and disclosed.
A method of making a reinforced integrated circuit chip that can be used in a smart card, the method comprising:
An integrated circuit die that can be used in a smart card, the die comprising:
In an device comprising an integrated circuit having one or more semiconductor portions, a system to reinforce one of more of the semiconductor portions, the system comprising a stiffener material having an outer peripheral dimension that matches up to a first semiconductor portion wherein the stiffener is laminated to the first semiconductor portion so that the stiffener provides mechanical reinforcement to the entire area of the first semiconductor portion, and wherein an adhesive material is disposed between the first semiconductor portion and the stiffner to bind the first semiconductor portion and the stiffener together.
Dependencies are inferred from the claim text.