Semiconductor device

A semiconductor device comprising:

• a pair of semiconductor chips that are placed next to each other in a same plane;
• a high-voltage bus bar that is bonded to one surface of one of the semiconductor chips and that has a high-voltage terminal;
• a low-voltage bus bar that is bonded to one surface of the other semiconductor chip and that has a low-voltage terminal;
• a first metal wiring board that is bonded to another surface of the first semiconductor chip;
• a second metal wiring board that is bonded to another surface of the other semiconductor chip;
• and
• an output bus bar having an output terminal extending from each end portion of the first metal wiring board and of the second metal wiring board.

A semiconductor device comprising:

• a power semiconductor element and a rectifier semiconductor element that are positioned on a predetermined surface;
• a first bus bar having a first bonding portion that is bonded to surfaces of the power semiconductor element and the rectifier semiconductor element, and having a first terminal that is extended in a direction perpendicular to a lengthwise direction of the first bonding portion;
• and
• a second bus bar having a second bonding portion that has a connecting-strip portion that is bonded to other surfaces of the power semiconductor element and the rectifier semiconductor element, and having a second terminal that is extended in a direction perpendicular to a lengthwise direction of the second bonding portion and in an opposite direction from the first terminal.