Contact-force sensor package and method of fabricating the same

Abstract

Provided are a contact-force sensor package and a method of fabricating the same. The contact-force sensor package includes an elastic layer comprising a side that contacts a source of a contact-force; and a substrate layer adhered to the opposing side of the elastic layer from the side that contacts the source of the contact-force and comprising a cantilever beam separated from the elastic layer and deformed due to the contact-force, a pillar extending from a free end portion of the cantilever beam to the elastic layer and transferring the contact-force from the elastic layer to the cantilever beam, and a deformation sensing element for generating an electrical signal that is proportional to a degree of deformation of the cantilever beam.

Dependencies are inferred from the claim text.