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US 2010/0148285 A1Published application
MEMS Component and Method for Production
AssigneeEpcos AG
InventorsChristian Bauer, Hans Krueger, Werner Ruile, Alois Stelzl
Life of this patent
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Abstract
A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip.
Claims22
A MEMS component comprising:
- a chip that has a front side and a rear side, the rear side having a low roughness of less than one tenth of a wavelength at a center frequency of an acoustic wave propagating during ordinary use of the component;
- component structures on the chip;
- and
- metallic structures for scattering bulk acoustic waves disposed on the rear side of the chip, wherein a material of the metallic structures is acoustically matched to a material of the chip.
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A method for producing a metal structure on a chip bearing component structures at its front side, the method comprising:
- applying a photopatternable resist on a rear side of the chip;
- patterning the resist therby giving rise to a negative structure;
- and
- forming a metal to those regions of the rear side of the chip that are not covered by the resist.
1 more element
Dependencies are inferred from the claim text.