Wafer joining method, wafer composite, and chip

A wafer composite, comprising:

• a first wafer;
• at least a second wafer, wherein at least two of the wafers are joined together, and wherein the wafers are fixed to each other via a sintered bonding material disposed between the wafers;
• wherein the first wafer is joined to the at least a second wafer, by depositing the sinterable bonding material on at least one of the wafers, joining the first wafer to the at least a second wafer, and sintering the bonding material through heating.

A sensor chip, including at least two wafer material levels, comprising:

• a first wafer material level;
• at least a second wafer material level, wherein at least two of the wafer material levels are joined together, and wherein the wafer material levels are fixed to each other via a sintered bonding material disposed between the wafer material levels;
• wherein the first wafer material level is joined to the at least a second wafer material level, by depositing the sinterable bonding material on at least one of the wafer material levels, joining the first wafer material level to the at least a second wafer material level, and sintering the bonding material through heating.