Insulating resin composition
AssigneeSamsung Electronics Co., Ltd.
InventorsEun Jeong JEONG, Jong Baek SEON
Life of this patent
Estimating the term…
Abstract
An insulating resin composition is provided. The insulating resin composition includes (A) a silicon-based polymer having either primary or secondary amine groups or both, (B) an organometallic compound, and (C) a solvent. The physicochemical properties of the insulating resin composition are maintained during processing steps for the fabrication of a semiconductor device. Therefore, the use of the insulating resin composition prevents deterioration of the characteristics of the semiconductor device arising from defects, spots, aggregates, and the like, in an insulating film and reduces the hysteresis of the semiconductor device to improve the characteristics of the semiconductor device.
Claims18
An insulating resin composition comprising:
- a silicon-based polymer having primary amine groups, secondary amine groups, or both primary and secondary amine groups,
- an organometallic compound, and
- a solvent.
Dependencies are inferred from the claim text.