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US 2010/0148201 A1Published application
Led package
AssigneeSamsung Electronics Co., Ltd.
InventorsHak Hwan Kim, Sung Kyong Oh, Soo Jin Jung, Hyung Kun Kim
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Abstract
There is provided an LED package including: a body unit; an LED chip mounted onto the body unit; lead frames mounted onto the body unit and electrically connected to the LED chip; and a reflection unit having a cavity to receive the LED chip therein and reflecting light emitted from the LED chip to the outside. Here, the reflection unit has a curved cross-section.
Claims8
An LED package comprising:
- a body unit;
- an LED chip mounted onto the body unit;
- lead frames mounted onto the body unit and electrically connected to the LED chip;
- and
- a reflection unit having a cavity to receive the LED chip therein and reflecting light emitted from the LED chip to the outside;
- wherein the reflection unit has a curved cross-section.
3 more elements
The LED package of 4, wherein molding materials filling spaces are created between the thermal pins, and
- molding materials are injected between the filling spaces, into the bottom of the body unit and the top of the body unit and between the lead frames.
Dependencies are inferred from the claim text.